SUNNY RISE CORP (U.S.A)

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PROPERTIES CHART-ELECTRONIC INDUSTRIAL USE ADHESIVE SERIES

Product
No.

Bonding substrates
and applications

Color

Viscosity
(cp)

Cure speed(min)
Full cure speed(hrs)

Shear strength
(kgf/cm²)

Temperature
Resistance(°C)

1120 Suitable for porous bottom and
printed PCB,damp proof and
static resistance.
lemon 650~950 25°C/7min/72 - -45~+200

1331

Dampproof from PCB circuit-
Board, anlistating, can be used
In spray, dip in and brush ways

Clear
Can be
Test by
Fluorescent
Lamp

200±20

10/24

-

-65~+125

29230B

General purpose, fast cured
Speed good bonding for metal
Plastic, rubber, shock-proof

Black

135,000

7/24

>3

-60~+120

29230C

General purpose, fast cured
Speed good bonding for metal ,Plastic, rubber ,shock-proof

Clear

135,000

7/24

>3

-60~+120

29231

Fast cure speed, suitable for
Plastic and metal

Black

100,000

10/12

>3

-60~+120

29232B

One component silicone, fast
Cured in room temperature
High voltage resistance

Black

60,000

5/24

>1

-60~+250

29234

No odor, low shrinkage,
Fast cured speed,
High strength bonding

Black

50,000~
100,000

5/24

>1.5

-60~+232

29236 PU fast cure adhesive,
multi-purpose, shockproof
Clear 48,000~
72,000
5/24 >30 -40~+66
29237B new patent flexible polymeric
sealing can be wildly used;
Suitable for thin film
and surface coating
Black
560,000~
720,000
15~20/24
>22
-40~+80
29238 Room temperature cure, low oder, suitable for glass,metal,
concrete and materials
Clear / white / black / gray
light gray / deep amber/
aluminium gery
Paste 10/48 >4 -48 ~ +149
3332 Low fluidness, suitable for
automatic constant temperature
control and power
resistor radiator etc
white Paste No cured - -55 ~ +180
8764 Acrylic bonding, multi-purpose,
shockproof, high strength
gray 100,000 Valume ratio=1:1
10~12 / 24
>150 -40 ~ +180
8765 Acrylic bonding, multi-purpose,
shockproof, high strength
gray 100,000 Valume ratio=1:1
20~25 / 24
>150 -40 ~ +180
8766 Double tube black epoxy, IC
wafer assembly protection
Black 40,000 30~90/24 >210 -55 ~ +120
8767 A/B epoxy, suitable for electronic parts
filling and coating
Black  4,500~5,500 weight ratio=4:1
35
>132 -40 ~ +120
8775 Good flesible after cured, good durability, and can keep
good shape when filling the
electroic components, no flowing
during heating process
A: Milk White
B: Light amber
A: 16,000~26,000
B: <200
weight ratio=1:1
9/24
>150 -40 ~ +120
9005-EC Silver Conductive adhesive,
hight viscosity, high conductivity,
high thermal conductivity for
LED chip
sliver 10,400~13,000 +80°C for 30min
+175°C for 60min
>80 -40 ~ +250
9008-EC Silver Conductive adhesive,
hight viscosity, high conductivity,
high Diathermancy,suitable
for LED
sliver 10,000~13,000 +80°C for 30min
~ 60min
>100 -40 ~ +120