SUNNY RISE CORP (U.S.A)

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PROPERTIES CHART---EPOXY RESIN SERIES

Product No.

Bonding substrates and
applications

Color

Viscosity
(cp)

Curing
condition((℃/min)

Hardness
Shore D

Storage
Method

3517 It is excellent in the repairable
of electron chip use.
Black 1,280~1,920 120℃/10min D84 Refrigerated
at 2~8℃
3530 Suitable for E-book sealing Black 2,400~3,600 80~120℃/10-120min D72 Refrigerated
at 2~8℃
3544W Underfill gap filling,
suitable LED sealing.
White 640~960 100~150℃/3-20min D77 Refrigerated
at 2~8℃

H3572L

Good for bonding
Electronic components

Black

68,000~
110,000

130℃/30min
150℃/10min

D89

Refrigerated
at 2~8℃

H3575

For small gaps underfill
Filling, flows fast, rework
Is possible

Black

2,000~5,000

120℃/10min

D72

Refrigerated
at 2~8℃

H3581

Good low temperature cure
Characteristics, suitable
For bonding electronic
Components on PCB

Black

40,000~
70,000

80℃/30min

D68

Freezer
at -40℃

3582

Suitable for the bonding of
lens module holder mount,
has execllent adhesion
strength whit LCP.

Black

180,000~
240,000

80℃/5~10min

D86

Refrigerated
at 2~8℃

3585

Suitable fixture for DIE.

White

Thixotropy
1,672,000~
2,508,000

80℃/30min

D68

Freezer
at -20℃

3595-07 Reworkable, low temperature
cured, fast penetration
Black 700 100°C / 5 min
90°C/10 min
83±2 Refrigerated
at 2~8℃
3595-09 Reworkable, low temperature
cured, fast penetration
Black 900 100°C / 5 min
90°C / 10 min
83 ± 2 Refrigerated
at 2~8℃
3602-4 Suitable for metal, glass and plastics,
such as e-book sealing with
hydrophobic character.
Yellow Thixotropy
90,000~110,000
80°C / 60 min D78 Freezer
at -20℃
3602-5 Suitable for metal, glass and plastics,
such as e-book sealing with
hydrophobic character.
Yellow Thixotropy
119,600~196,000
80°C / 60 min D78 Freezer
at -20℃
3613 Coating, sealant and adhesive. Black 432,000~648,000 80 ~ 120°C / 240 min D85 Refrigerated
at 2~8℃
3618 Suitable for connector and
flexible flat Cable adhesion.
Black Thixotropy
40,000~100,000
80°C / 30 min D68 Freezer
at -40℃
3620 PCB coating. White Thixotropy 
328,000~492,000
70 ~ 80°C/
30 ~60 min
D85 Freezer
at -20℃
3630 Suitable on electron product potting,
gap filling and sealant.
Yellow 780~1,200 80°C / 30 min D80 Freezer
at -20℃

RES08-B

High temperature resistance
High strength, for bonding
Metal, ceramic, heat resistant
Plastics, PCB etc.

Black

Thixotropy
36,000~42,000

150℃/40min

75±2

Refrigerated
at 5~10℃